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this is information on a product in full production. december 2013 docid14174 rev 13 1/25 vni4140k quad high-side smart power solid-state relay datasheet - production data features ? output current: 0.7 a per channel ? shorted load protections ? junction overtemperature protection ? case overtemperature protection for thermal independence of the channels ? thermal case shutdown restart not simultaneous for the various channels ? protection against loss of ground ? current limitation ? undervoltage shutdown ? open drain diagnostic outputs ? 3.3 v cmos/ttl compatible inputs ? fast demagnetization of inductive loads ? conforms to iec 61131-2 ? esd according to iec 61000-4-2 up to +/- 25 kv description the vni4140k is a monolithic device made using stmicroelectronics vipower technology, intended to drive four independent resistive or inductive loads with one side connected to ground. active current limitation avoids dropping the system power supply in case of shorted load. built-in thermal shutdown protects the chip from overtemperature and short-circuit. in overload conditions, channel turns off and back on automatically so to maintain junction temperature between t tsd and t r . if this condition makes case temperature reach t csd , overloaded channel is turned off and restart only when case temperature has decreased down to t cr . in case of more than one channel in overload, restart of the overloaded channels is not simultaneous, in order to avoid high peak current from the supply. non-overloaded channels continue operating normally. the open drain diagnostics outputs indicate overtemperature conditions. figure 1. block diagram type v demag (1) 1. per channel. r ds(on) (1) i out (1) v cc vni4140k v cc -41 v 0.08 0.7 a 41 v powersso-24 gipd0611130956lm www.st.com
contents vni4140k 2/25 docid14174 rev 13 contents 1 pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 typical application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 switching waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 package and pc board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.1 vni4140k thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10 demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 12 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
docid14174 rev 13 3/25 vni4140k pin connection 25 1 pin connection figure 2. pin connection (top view) table 1. pin description pin name description tab tab exposed tab internally connected to v cc 1v cc supply voltage 2 in1 channel 1 input 3.3 v cmos/ttl compatible 3 stat1 channel 1 status in open drain configuration 4 in2 channel 2 input 3.3 v cmos/ttl compatible 5 sta2 channel 2 status in open drain configuration 6 gnd device ground connection 7 stat3 channel 3 status in open drain configuration 8 in3 channel 3 input 3.3 v cmos/ttl compatible 9 stat4 channel 4 status in open drain configuration 10 in4 channel 4 input 3.3 v cmos/ttl compatible 11 nc 12 nc 13 out4 channel 4 power stage output, internally protected 14 out4 channel 4 power stage output, internally protected 15 out4 channel 4 power stage output, internally protected 16 out3 channel 3 power stage output, internally protected 17 out3 channel 3 power stage output, internally protected out1 out1 out1 out2 out2 out2 v cc in1 stat1 in2 stat2 gnd out3 out3 out3 out4 out4 out4 stat3 in3 stat4 nc nc in4
pin connection vni4140k 4/25 docid14174 rev 13 pin name description 18 out3 channel 3 power stage output, internally protected 19 out2 channel 2 power stage output, internally protected 20 out2 channel 2 power stage output, internally protected 21 out2 channel 2 power stage output, internally protected 22 out1 channel 1 power stage output, internally protected 23 out1 channel 1 power stage output, internally protected 24 out1 channel 1 power stage output, internally protected table 1. pin description (continued)
docid14174 rev 13 5/25 vni4140k maximum ratings 25 2 maximum ratings 2.1 thermal data table 2. absolute maximum ratings symbol parameter value unit v cc power supply voltage 41 v -v cc reverse supply voltage -0.3 v i gnd dc ground reverse current -250 ma i out output current (continuous) internally limited a i r reverse output current (per channel) -5 a i in input current (per channel) 10 ma v in input voltage +v cc v v stat status pin voltage +v cc v i stat status pin current 10 ma v esd electrostatic discharge (r = 1.5 k ; c = 100 pf) 2000 v e as i out = 500 ma t amb = 125 c 5 j p tot power dissipation at t c = 25 c internally limited w t j junction operating temperature internally limited c t stg storage temperature -55 to 150 c table 3. thermal data symbol parameter value unit r th(jc) thermal resistance junction-case (1) 1. per channel. max. 2 c/w r th(ja) thermal resistance junction-ambient max. see figure 11 c/w
electrical characteristics vni4140k 6/25 docid14174 rev 13 3 electrical characteristics 10.5 v < v cc < 36 v; -40 c < t j < 125 c; unless otherwise specified v cc = 24 v; -40 c < t j < 125 c, r l = 48 , input rise time < 0.1 s table 4. power section symbol parameter test conditions min. typ. max. unit v cc supply voltage 10.5 36 v r ds(on) on-state resistance i out = 0.5 a at t j = 25 c i out = 0.5 a 0.080 0.140 v clamp i s = 20 ma 41 45 52 v i s supply current all channels in off state on state with v in = 5 v (t j = 125 c) 250 2.4 4 a ma i lgnd output current at turn- off v cc = v stat = v in = v gnd = 24 v, v out = 0 v 1ma v out(off) off state output voltage v in = 0 v and i out = 0 a 1 v i out(off) off state output current v in = v out = 0 v 0 5 a f cp charge pump frequency channel in on state (1) 1. to cover en55022 class a and class b normative. 1450 khz table 5. switching symbol parameter min. typ. max. unit t d (on) turn on delay - 20 - s t r rise time - 10 - s t d (off) turn off - 30 - s t f fall time - 8 - s dv/dt (on) turn on voltage slope - 3 - v/s dv/dt (off) turn off voltage slope - 4 - v/s
docid14174 rev 13 7/25 vni4140k electrical characteristics 25 table 6. logical input symbol parameter test condition min. typ. max. unit v il input low level voltage 0.8 v v ih input high level voltage 2.20 v v i(hyst) input hysteresis voltage 0.15 v i in input current v in = 15 v 10 ? v in = 36 v 210 table 7. protection and diagnostic symbol parameter test conditions min. typ. max. unit v stat status voltage output low i stat = 1.6 ma 0.6 v v usd undervoltage protection 7 10.5 v v usdhys undervoltage hysteresis 0.4 0.5 v i lim dc short-circuit current v cc = 24 v; r load < 10 m 0.7 1 1.7 a i peak maximum dc output current dynamic load 1.3 a hyst tracking limits 0.2 a i lstat status leakage current v cc = v stat = 36 v 30 ? t tsd junction shutdown temperature 150 170 190 c t r junction reset temperature 135 c t hyst junction thermal hysteresis 715 c t csd case shutdown temperature 125 130 135 c t cr case reset temperature 110 c t chyst case thermal hysteresis 715 c v demag output voltage at turn-off i out = 0.5 a; l load >= 1 mh v cc -41 v cc -45 v cc -52 v
electrical characteristics vni4140k 8/25 docid14174 rev 13 figure 3. current and voltage conventions gipd0611131000lm
docid14174 rev 13 9/25 vni4140k truth table 25 4 truth table 5 typical application circuit figure 4. typical application circuit table 8.truth table condition inputn outputn statusn normal operation l h l h h h overtemperature l h l l h l undervoltage l h l l x x shorted load (current limitation) l h l x h h gipd0611131009lm
typical application circuit vni4140k 10/25 docid14174 rev 13 figure 5. thermal behavior no tj ( i ) > tt s d vi n ( i ) = h out(i) off stat(i) on (l) tc > tc s d no yes no yes tc > tc r yes no tj(i) > tjr yes stat(i) off (h) out(i) on 1) 4) 2) 3) gipd0611131015lm
docid14174 rev 13 11/25 vni4140k switching waveforms 25 6 switching waveforms figure 6. switching waveforms gipd0611131025lm
pin functions vni4140k 12/25 docid14174 rev 13 7 pin functions figure 7. input circuit figure 8. status circuit gipd0611131030lm gipd0611131035lm
docid14174 rev 13 13/25 vni4140k pin functions 25 figure 9. charge pump switching frequency (typical) vs. temperature gipd0611131040lm
package and pc board thermal data vni4140k 14/25 docid14174 rev 13 8 package and pc board thermal data 8.1 vni4140k thermal data figure 10. vni4140k pc board note: layout condition of r th and z th measurements (pcb: double layer, thermal vias, fr4 area =77 mm x 86 mm, pcb thickness =1.6 mm, cu thickness = 70 mm (front and back side), copper areas: from minimum pad layout to 8 cm 2 ). figure 11. r th(ja) vs. pcb copper area in open box free air condition (one channel on)
docid14174 rev 13 15/25 vni4140k package and pc board thermal data 25 figure 12. vni4140k thermal impedance junction ambient single pulse (one channel on)
reverse polarity protection vni4140k 16/25 docid14174 rev 13 9 reverse polarity protection reverse polarity protection can be implemented on board using two different solutions: 1. placing a resistor (r gnd ) between ic gnd pin and load gnd 2. placing a diode between ic gnd pin and load gnd if option 1 is selected, the minimum resistance value has to be selected according to the following equation: equation 1 r gnd v cc /i gnd where i gnd is the dc reverse ground pin current and can be found in section 2: maximum ratings of this datasheet. power dissipated by r gnd (when v cc < 0: during reverse polarity situations) is: equation 2 pd = (v cc ) 2 /r gnd if option 2 is selected, the diode has to be chosen by taking into account vrrm >|v cc | and its power dissipation capability: equation 3 p d i s *v f note: in normal conditions (no reverse polarity) due to the diode, there is a voltage drop between gnd of the device and gnd of the system. figure 13. reverse polarity protection this schematic can be used with any type of load. status i input i gnd output i + vcc r gnd load diode status i input i gnd output i + vcc r gnd load diode
docid14174 rev 13 17/25 vni4140k demagnetization energy 25 10 demagnetization energy figure 14. maximum demagnetization energy vs. load current, typical values 0.10 0.60 1.10 1.60 2.10 2.60 3.10 3.60 4.10 4.60 5.10 0.1 0.3 0.5 0.7 0.9 1.1 single channel demagnetization four channels demagnetization iout (a) eoff (j) t amb= 125 c gipd0511130116lm
package mechanical data vni4140k 18/25 docid14174 rev 13 11 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 9. powersso-24 mechanical data symbol mm min. typ. max. a 2.15 2.47 a2 2.15 2.40 a1 0 0.075 b 0.33 0.51 c 0.23 0.32 d 10.10 10.50 e 7.4 7.6 e 0.8 e3 8.8 g 0.1 g1 0.06 h 10.1 10.5 h 0.4 l 0.55 0.85 n 10deg x 4.1 4.7 y 6.5 7.1
docid14174 rev 13 19/25 vni4140k package mechanical data 25 figure 15. powersso-24 package dimensions figure 16. powersso-24 tube shipment (no suffix) note: all dimensions are in mm. table 10. powersso-24 tube shipment base quantity 49 bulk quantity 1225 tube length ( 0.5) 532 a 3.5 b 13.8 c ( 0.1) 0.6
package mechanical data vni4140k 20/25 docid14174 rev 13 figure 17. powersso-24 reel shipment (suffix ?tr?) table 11. powersso-24 reel dimensions base quantity 1000 bulk quantity 1000 a (max.) 330 b (min.) 1.5 c ( 0.2) 13 f 20.2 g (2 0) 24.4 n (min.) 100 t (max.) 30.4
docid14174 rev 13 21/25 vni4140k package mechanical data 25 figure 18. powersso-24? tape dimensions note: according to electronic industries association (eia) standard 481 rev. a, feb 1986 table 12. powersso-24? tape dimensions tape width w 24 tape hole spacing p0 ( 0.1) 4 component spacing p 12 hole diameter d ( 0.05) 1.55 hole diameter d1 (min.) 1.5 hole position f ( 0.1) 11.5 compartment depth k (max.) 2.85 hole spacing p1 ( 0.1) 2
package mechanical data vni4140k 22/25 docid14174 rev 13 figure 19. vn14140k suggested footprint note: stmicroelectronics is not responsible for any pcb related issues. the footprint shown in the above figure is a suggestion which might not be in line to the customer pcb supplier design rules. all dimensions are in mm. 6roghu0dvn2shqlqj 5
docid14174 rev 13 23/25 vni4140k ordering information 25 12 ordering information table 13. order code order code package packaging vni4140k powersso-24 tube VNI4140KTR powersso-24 tape and reel
revision history vni4140k 24/25 docid14174 rev 13 13 revision history table 14. document revision history date revision changes 16-nov-2007 1 initial release. 26-nov-2007 2 updated electrical parameters values. 08-jul-2008 3 inserted: figure 4 on page 9 and section 9: reverse polarity protection on page 16 . 08-apr-2008 4 added i lgnd parameter in table 4 on page 6 . 27-aug-2009 5 updated section 9: reverse polarity protection . 09-dec-2009 6 added section 10: conformity to iec 61000-4-2 esd immunity test. 15-apr-2010 7 updated table 5 on page 6 . 06-feb-2012 8 inserted feature: conformity to iec 61000-4-2 esd immunity test in cover page. removed chapter: conformity to iec 61000-4-2 esd immunity test. 05-mar-2012 9 suggested footprint inserted. in table 4 parameter i lgnd has been added. 19-mar-2012 10 minor text changes. 20-dec-2012 11 operating temperature range extended. 06-nov-2013 12 updated e as value in table 2: absolute maximum ratings . added figure 14 . 11-dec-2013 13 updated section 9 .
docid14174 rev 13 25/25 vni4140k 25 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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